NCT214
http://onsemi.com
19
PACKAGE DIMENSIONS
WDFN10, 3x3, 0.5P
CASE 522AA
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
C
A
SEATING
PLANE
D
B
E
0.15
C
A3
A
A1
2X
2X
0.15
C
DIM
A
MIN
NOM
MAX
MILLIMETERS
0.70
0.75
0.80
A1
0.00
0.03
0.05
A3
0.20 REF
b
0.18
0.24
0.30
D
3.00 BSC
D2
2.45
2.50
2.55
E
3.00 BSC
1.75
1.80
1.85
E2
e
0.50 BSC
0.19 TYP
K
PIN ONE
REFERENCE
0.08
C
0.10
C
10X
A
0.10
C
NOTE 3
L
e
D2
E2
b
B
5
6
10X
1
K
10
10X
10X
0.05
C
0.35
0.40
0.45
L
TOP VIEW
SIDE VIEW
BOTTOM VIEW
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
2.1746
2.6016
1.8508
0.5000 PITCH
0.5651
10X
3.3048
0.3008
10X
DIMENSIONS: MILLIMETERS
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